High Density Interconnect (HDI) Design

With electronics products becoming smaller and smaller, it is very important for PCB layout designers to be not only familiar but be able to know how to design High-Density Interconnect (HDI) designs. When it comes to using very fine pitch IC’s and even discreet components that are as small as 0201 sizes, the layout design is forced to go into HDI design. That is when the use of blind and buried at times stacked vias technology will start to be used.

HDI technology will certainly increase the fabrication process to be rather difficult and the cost of the fabrication will increase dramatically. The same thing goes for the assembly process because of the fact that it is very challenging to assemble the miniature size parts.

There is an excellent resource (The HDI Handbook) that is freely available to learn and have a very excellent understanding of what HDI is and how to design HDI PCB layout. Please download the free handbook from this website.

“In The HDI Handbook, editor-in-chief, Happy Holden, has brought together authors whose skills in particular elements of this new set of technological issues are of the highest caliber and who are respected throughout the industry. The collaboration of experts is critical since no one person can go into the detail required for so many different issues. The book is not meant to replace or repeat the discussions in the Printed Circuits Handbook, but to build upon those discussions and provide details which are beyond the scope of that book.”